SCHOTT Glass Panels

SCHOTT Glass Panels are designed to advance Moore's Law and push the boundaries of advanced heterogeneous packaging and high-density interconnect technologies. These highly precise panels enable the seamless assembly of semiconductor ICs, radio frequency emitters, antennas, sensors, and other microelectronic devices. They excel in through glass via (TGV) formation and subsequent high-performance metallization. Available in various glass types with a wide range of properties and thicknesses, all featuring outstanding bulk and surface quality. The panels can be precisely tailored to meet advanced multiple IC device requirements. They facilitate critical processing steps in manufacturing microelectronic packaging components with proven capability for ultra-fine high-density TGV laser structuring combined with large openings for embedding active or passive components. SCHOTT Glass Panels provide a scalable and cost-effective solution for high-performance IC substrates and interposers with beneficial electrical properties in the GHz range, high stiffness, and low surface roughness to support advanced packaging needs.