SCHOTT Glass Panels for advanced semiconductor packaging
Aussteller werden
SCHOTT Glass Panels are advanced semiconductor packaging materials featuring geometric variability with sizes including 510 x 515 mm and thicknesses from 0.5 to 1.1 mm. They offer tailored thermal expansion coefficients from 3-8 ppm/K and above for compatibility with various semiconductors. The panels feature ultra-smooth surface quality with roughness less than 1 nm, superior mechanical stability, and enable both fine copper line structuring on the surface and precise structuring through the glass substrate, supporting high-density TGV laser structuring and large openings for component embedding.
Informations produit
| Fabricant | Aussteller werden |
|---|
Plus de produits
Des informations ou fichiers vous manquent ?
