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Microelectronic Packaging

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SCHOTT Microelectronic Packaging offers hermetically-sealed packages and glass-to-metal sealing solutions with over 80 years of experience. Products feature outstanding reliability for extreme conditions, miniaturization capabilities, superior thermal management, and high-speed integration. The portfolio includes glass-to-metal sealed (GTMS) packages, laser welding solutions, and brazing/soldering technologies suitable for microwave packaging, sensor technology, medical applications, and power electronics.

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