SCHOTT Glass Panels for advanced semiconductor packaging

SCHOTT Glass Panels are available in a wide range of dimensions, including a 510 x 515 mm size and thicknesses ranging from 0.5 to 1.1 mm. Custom sizes are available on request, ensuring strict tolerances to meet the demands on processing and performance of advanced packages. They offer a range of coefficients of thermal expansion (CTE) from 3 - 8 ppm/K and above, ensuring best compatibility with various semiconductors and other partner materials co-assembled in the package. Featuring a reproducible ultra-smooth surface quality with a roughness less than 1 nm, SCHOTT Glass Panels provide the optimal foundation for fine line metallization with a high peel-off strength. They enable both extremely fine copper line structuring on the surface and precise structuring through the glass substrate, supporting high-density TGV laser structuring as well as large openings for embedding active and passive components.