SCHOTT MEMPax® technical details

MEMPax® is a borosilicate glass material offering exceptional durability in extremely low thicknesses with outstanding chemical resistance and suitability for high-temperature bonding. Features a coefficient of thermal expansion that matches silicon wafers for anodic bonding with minimal stress. Offers high transmission in visible and deep UV wavelength ranges for UV debonding in semiconductor processes. Available in custom shapes and standard round varieties with sizes ranging from 2-12 inches and thicknesses from 0.07-0.55 mm. Extremely low surface roughness (typically Ra ≤ 0.5 nm) facilitates bonding processes.