SCHOTT FLEXINITY® connect

FLEXINITY® connect is a high-performance structured glass substrate that expands SCHOTT's FLEXINITY® portfolio towards smaller holes in high numbers positioned extremely close to each other. It offers increased design flexibility alongside the highest I/O counts and the lowest electrical resistance for advanced packaging. The product is available in various glass types and formats in a wide range of thicknesses at the sampling level. FLEXINITY® connect provides a high-performance alternative to silicon and copper clad laminate, featuring a smooth surface and excellent coefficient of thermal expansion (CTE) match, making it suitable for advanced chip packaging solutions in semiconductors, data centers, 5G, and autonomous driving applications.