SCHOTT FLEXINITY® connect

FLEXINITY® connect is a structured glass substrate designed for advanced packaging applications. It offers increased design flexibility, highest I/O counts, and lowest electrical resistance compared to silicon and copper clad laminates. The product features through-glass vias (TGVs) with small holes in high density, available in various glass types and formats with a wide range of thicknesses. It provides a smooth surface, excellent coefficient of thermal expansion (CTE) match, and enables embedding of passive devices. FLEXINITY® connect is ideal for semiconductor chip packaging, high-performance computing, 5G/6G communication, autonomous driving, and medical diagnostics applications.