FLEXINITY® connect
SCHOTT AG
FLEXINITY® connect offers a high-performance alternative to traditional materials such as silicon and copper-clad laminates for advanced packaging substrates. The combination of perfectly suited materials with exceptionally accurate dimensions lifts FLEXINITY® connect to the next level of semiconductor packaging. Currently, FLEXINITY® connect is available for sampling only and not as a commercial product.
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| Hersteller | SCHOTT AG |
|---|
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