SCHOTT Glass Panels

SCHOTT Glass Panels are designed to advance Moore's Law by pushing the boundaries of advanced heterogeneous packaging and high-density interconnect technologies. These highly precise panels seamlessly enable the assembly of semiconductor ICs, radio frequency emitters, antennas, sensors, and other microelectronic devices. They excel in through glass via (TGV) formation and subsequent high-performance metallization. Available in various glass types with a wide range of properties and thicknesses, featuring outstanding bulk and surface quality. The panels can be precisely tailored to meet an unlimited number of advanced multiple IC devices. They offer proven capability for ultra-fine high-density TGV laser structuring combined with large openings for embedding active or passive components. The glass's superior surface quality ensures exceptional metallization performance. SCHOTT Glass Panels provide a scalable and cost-effective solution for high-performance IC substrates and interposers with high stiffness, low surface roughness, and high optical transmittance to support advanced packaging needs.