HermeS® Hermetic Through Glass Vias (TGV) Wafers

Sturdy materials and miniaturized design options make HermeS® Hermetic Through Glass Vias (TGV) Wafers incredibly versatile, with key roles in the medical world, telecoms sector, and industrial and automotive operations. The reliability and performance of MEMS devices are reliant on the long-term robustness of MEMS packaging technology. HermeS® Hermetic TGV Wafers provide outstanding radio frequency properties thanks to their miniaturized design and impressive hermetic capabilities. These wafers are ideal for housing medical MEMS devices such as blood pressure sensors and neurostimulators because the robust electronic packaging protects the equipment against body fluids.